Investigation of Ni/CuO Interface by X-Ray Photoelectron Spectroscopy
Document Type
Thesis
Degree Name
Master of Science (MS)
Department
Physics and Astronomy
Date of Award
9-1-2026
Abstract
This work investigates the room temperature interfacial chemical reactions between nickel (Ni) thin films and copper oxide (CuO) substrates. The technique of X-ray photoelectron spectroscopy (XPS) has been used for this purpose. Thin films of Ni were deposited on CuO substrates maintained at room temperature using the electron beam (e-beam) evaporation technique. The XPS measurements were performed in the Ni 2p and Cu 2p core level regions to analyze the chemical states of the constituents at the interface. Particular attention was given to the high binding energy spectral features associated with the core level peaks, as these provide important information regarding the chemical reactivity at the interface. The experimental results reveal significant interfacial reactions between Ni and CuO. Specifically, the CuO substrate was observed to undergo reduction to elemental copper (Cu), while the deposited Ni film became oxidized forming nickel oxide (NiO). Furthermore, the interface width was estimated from the XPS spectral analysis, providing additional insight into the extent of interfacial mixing and reaction dynamics. The study contributes to a better understanding of metal/oxide interfaces, which are important in thin film devices, catalysis, and electronic applications.
Advisor
A. R. Chourasia
Subject Categories
Physical Sciences and Mathematics | Physics
Recommended Citation
Chy, Jannati Islam, "Investigation of Ni/CuO Interface by X-Ray Photoelectron Spectroscopy" (2026). Electronic Theses & Dissertations. 1387.
https://lair.etamu.edu/etd/1387
